14 janvier 2025

AIM participe au symposium SMTA sur l'interconnexion à ultra-haute densité

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona. As a proud member of SMTA, AIM […]

AIM participe au symposium SMTA sur l'interconnexion à ultra-haute densité Lire la suite "

AIM présentera la pâte à souder ultrafine No Clean NC259FPA au salon SMTA Austin Expo & Tech Forum

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas. Among other great products, AIM will be

AIM présentera la pâte à souder ultrafine No Clean NC259FPA au salon SMTA Austin Expo & Tech Forum Lire la suite "