W20
WATER SOLUBLE SOLDER PASTE
Características
- Zero halide & halogen per current Rev J-STD-004
- 8+ hour stencil life
- Low voiding on QFN and BGA’s
- Easy to clean residues using DI water
- Extended cleaning window of 2+ weeks
- Low foaming formulation
- Wide reflow process window
- Disponible en SAC305
- RoHS Compliant*
W20 Pasta de soldar soluble en agua
AIM’s W20 Pasta de soldar soluble en agua has been developed to meet the industry’s demand for a consistently reliable zero-halogen water soluble solder paste. W20 offers enhanced wetting performance in an innovative halogen-free flux chemistry. W20 exhibits excellent print performance with an 8+ hour stencil life while reducing voids on challenging SMT components. This all-purpose water soluble solder paste leaves post-reflow residues that are easily removed with plain or DI water, even under low stand-off devices. W20 is formulated for use with SAC305 T4 powder and is a RoHS compliant solder paste. W20 solder paste can be combined with WS716 liquid flux and WS482 solder wire for a zero-halogen water soluble solution.
*Aleaciones sin plomo
- For use in SMT applications where PCB washing is required. W20 residues are easily cleaned using DI water, even under low standoff components
- Provides stable print performance for the most demanding electronic assemblies
- Reduces overall voiding without nitrogen
- Post reflow residues can be cleaned easily after waiting 2 weeks after initial reflow
| Aleaciones | Temperaturas de fusión (℃) | Rango de temperatura máxima de reflujo (℃) | Atributos de la aleación |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | • Excelentes características de humectación • Compatible con todos los tipos de flux |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Si el documento que necesita no figura en la lista siguiente, póngase en contacto con su representante local del servicio de atención al cliente de AIM o con Contacto para solicitar el documento.