V9 Low Voiding
NO CLEAN SOLDER PASTE
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-LF-Paste-500g-Jar-300x300.gif)
Características
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- Available in SAC305 T4
- Cumple con REACH y RoHS*
V9 Low Voiding No Clean Solder Paste
Descripción del producto
Uso de la aplicación
Información del producto
Documentos técnicos
Product Videos
Descripción del producto
V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
*Aleaciones sin plomo
Uso de la aplicación
- Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
- Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
- Electrochemical reliability fit for aerospace and military assemblies
- Wide process window: void reduction across a variety of reflow profiles
Información del producto
Aleaciones | Temperaturas de fusión (℃) | Rango de temperatura máxima de reflujo (℃) | Atributos de la aleación |
---|---|---|---|
SAC305 | 217°C -220°C | 230°C-260°C | • Excelentes características de humectación • Compatible con todos los tipos de flux |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Documentos técnicos
Si el documento que necesita no figura en la lista siguiente, póngase en contacto con su representante local del servicio de atención al cliente de AIM o con Contacto para solicitar el documento.
Product Videos