M8
NO CLEAN SOLDER PASTE
Características
- Excellent print transfer efficiencies on 01005s and >0.50 area ratios
- Formulated for use with T4 and finer powders
- Low voiding: <5% on BGAs and <10% on BTC components
- Eliminate s HiP (head-in-pillow) defects
- Minimal transparent residue – LED compliant
- Pin-testable
- Powerful wetting on lead-free surfaces
- Passes Bono and automotive SIR testing
- 8+ hour stencil life
- Disponible en aleaciones con y sin plomo
- Cumple con REACH y RoHS*
La pasta de soldadura M8 No Clean
AIM engineered La pasta de soldadura M8 No Clean for the most demanding applications, including automotive, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.
M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.
To guarantee the highest quality, AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.
*Aleaciones sin plomo
M8: Powerful, Reliable, Adaptable
- Provides stable print performance for the most demanding, high density electronic assemblies
- Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
- Accommodates a wide range of profiling processes and techniques
- Reduces DPMO (Defects Per Million Opportunities)
- Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
- Available for printing and dispensing solder paste applications
| Aleaciones | Temperaturas de fusión (℃) | Rango de temperatura máxima de reflujo (℃) | Atributos de la aleación |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | • Excelentes características de humectación |
| REL61 | 208°C -215°C | 230°C-250°C | - Mayor fiabilidad frente a las aleaciones con bajo contenido en plata o sin plata - Alternativa económica a las aleaciones SAC - Mejor humectación frente a las aleaciones con poca/sin plata |
| REL22 | 210°C -219°C | 230°C-250°C | • Enhanced/ High reliability for use in extremely harsh environments - Rendimiento mejorado de los ciclos térmicos - Mejor humectación frente a las aleaciones con poca/sin plata |
| SN100C | 227°C | 240°C-260°C | - Alternativa económica a las aleaciones SAC • Silver-Free - Juntas de soldadura brillantes |
| Sn63/Pb37 | 183°C | 205°C-235°C | - Aleación heredada para soldadura electrónica - Aprobado por Mil-spec • Product contains Pb (leaded alloy) |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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