One-Step Underfill 688 is a low surface tension, single component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves assembly reliability through high Tg, low CTE, and good fill with no voiding. Faster throughput and higher yields can be achieved using One-Step Underfill 688 because of its excellent capillary action, fast reflow characteristics, and rapid cure speeds.

One-Step Underfill 688 can be dispensed after solder paste printing, before component placement. The entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process, eliminating the need for a second assembly process and separate cure cycle.

One-Step Underfill 688 wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces and does not require flux. It is compatible with AIM’s full line of no clean flux chemistries.

• Improves mechanical reliability of assembly for use in harsh environments
• Increases drop-shock and vibration performance on SMT components
• Stable viscosity throughout shelf life
• Cures in lead-free profile
• May be reworked starting at 120° C (250°F)

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• One-Step Underfill 688 TDS - Español
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