NC259FPA Ultrafine
NO CLEAN SOLDER PASTE
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Características
- Precise print definition with Type 6 and finer solder powder
- Excellent Wetting
- High shear strength
- Clear flux residue
- Nitrogen reflow recommended
- Zero halogen/halogen-free
- 8-hour stencil life
- REACH and RoHS Compliant
NC259FPA Soldadura en Pasta Ultrafina No Clean
Descripción del producto
Uso de la aplicación
Información del producto
Documentos técnicos
Descripción del producto
Solder pastes with ultra fine alloy powders, such as T6 or finer, are essential for a range of emerging and advanced applications where precision, reliability, and miniaturization are paramount.
AIM’s NC259FPA Soldadura en Pasta Ultrafina No Clean is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
AIM’s NC259FPA Soldadura en Pasta Ultrafina No Clean is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
Uso de la aplicación
- MiniLED and MicroLED assembly
- Small and/or complex die attach in semiconductor assembly
- Micro BGA assembly
- Any applications reliant on print apertures ≤ 70 µm
- Dispensing applications such as jet printing
- High density interconnect (HDI) boards
Información del producto
Aleaciones | Temperaturas de fusión (℃) | Rango de temperatura máxima de reflujo (℃) | Atributos de la aleación |
---|---|---|---|
SN100C | 227°C | 245°C-260°C | • High purity • Eutectic alloy • Low melting temperature |
SAC305 | 217°C -220°C | 230°C-260°C | • Excelentes características de humectación • Compatible con todos los tipos de flux |
*T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Documentos técnicos
Si el documento que necesita no figura en la lista siguiente, póngase en contacto con su representante local del servicio de atención al cliente de AIM o con Contacto para solicitar el documento.