H10 Halogen-Free
NO CLEAN SOLDER PASTE
Características
- Halide/Halogen-Free
- Excellent Wetting
- Low BTC and BGA Voiding
- Alta confiabilidad
- Print Capability to 0.50 Area Ratio with T4
- Available in Multiple Lead-Free Alloys
- Cumple con REACH y RoHS*
La pasta de soldar no clean sin halógenos H10
La pasta de soldar no clean sin halógenos H10 is engineered to provide robust, stable performance for automotive, LED lighting and aerospace assemblies. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. H10 is zero halogen per EN14562 and halide-free per IPC J-Std-004 current rev. H10 is compatible with AIM’s full line of no clean flux chemistries.
*Aleaciones sin plomo
- Exceptional transfer efficiency required for ultraminiature component assemblies
- Wide process window – drop-in for most AIM no clean solder pastes
- Extended stencil life
- Environmentally friendly: zero halogen
| Aleaciones | Temperaturas de fusión (℃) | Rango de temperatura máxima de reflujo (℃) | Atributos de la aleación |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C |
|
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Si el documento que necesita no figura en la lista siguiente, póngase en contacto con su representante local del servicio de atención al cliente de AIM o con Contacto para solicitar el documento.