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AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED Materials Award at Hangjia

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Soldadura en Pasta Ultrafina No Clean, has been honored with the Most Influential MiniLED Materials Award at the recent Hangjia Aurora Awards Ceremony. This prestigious accolade was presented during the annual Mini/Micro LED Conference held in Hangjia, China.

The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter, setting a new industry standard in miniaturization and precision.

Key features of the NC259FPA Ultrafine No Clean Solder Paste include:

  • Excellent Wetting: Ensures strong, reliable joints for long-term performance.
  • High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
  • High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing.
  • High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.

The award highlights AIM Solder’s commitment to advancing solder technology and its dedication to supporting the evolving needs of the electronics manufacturing sector.

“We are thrilled to receive this award,” said Michael Zou, Lighting and Display Business Manager at AIM Solder. “The NC259FPA paste represents a feat of innovation. We’ve been very proud of its performance and the results our customers are seeing with it.”

For more information about AIM Solder’s NC259FPA Ultrafine No Clean Solder Paste and other products, please visit www.aimsolder.com.

Acerca de AIM

Con sede en Montreal, Canadá, AIM Solder, es líder global en la manufactura de materiales de ensamble para la industria electrónica, con instalaciones para la fabricación, distribución y soporte localizadas en todo el mundo. AIM fabrica avanzados productos de soldadura para una amplia gama de industrias, tales como soldadura en pasta, flux líquido, alambre tubular, barras para soldar, resina epoxi, materiales para soldar libres de plomo y haluros, así como aleaciones especializadas de soldadura de indio y oro. Galardonada con numerosos reconocimientos importantes de la industria SMT, AIM está seriamente comprometida con la investigación innovadora, la mejora continua de productos y procesos, a la vez que provee una experiencia de soporte técnico, servicios, y programas de capacitación de primera calidad a sus clientes. Para más información sobre AIM, visita www.aimsolder.com.

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