Cranston, Rhode Island EE.UU. – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its ground breaking product, NC259FPA Soldadura en Pasta Ultrafina No Clean, has been honored with the 2024 Circuits Assembly NPI Award for solder materials. This accolade is a testament to AIM Solder’s commitment to innovation and excellence in the electronics manufacturing industry.
The Circuits Assembly NPI Awards recognize the leading new products for electronics assembly during the past year. Winning this award underscores AIM Solder’s dedication to developing products that advance the electronics manufacturing sector, meet the evolving needs of our customers, and set new standards for quality and reliability.
The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter, setting a new industry standard in miniaturization and precision.
Key features of the NC259FPA Ultrafine No Clean Solder Paste include:
- Excellent Wetting: Ensures strong, reliable joints for long-term performance.
- High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
- Alta confiabilidad: Meets the rigorous standards required in high-performance electronics manufacturing.
- High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.
“We are incredibly proud to receive the 2024 Circuits Assembly NPI Award,” said Timothy O’Neil, Director of Product Management at AIM Solder. “This award is a reflection of our team’s hard work, dedication, and relentless pursuit of excellence. We remain committed to providing our customers with superior products and services, and this recognition further motivates us to continue innovating and exceeding industry standards.”
For more information about AIM Solder’s NC259FPA Ultrafine No Clean Solder Paste and other products, please visit www.aimsolder.com.
Con sede en Montreal, Canadá, AIM Solder, es líder global en la manufactura de materiales de ensamble para la industria electrónica, con instalaciones para la fabricación, distribución y soporte localizadas en todo el mundo. AIM fabrica avanzados productos de soldadura para una amplia gama de industrias, tales como soldadura en pasta, flux líquido, alambre tubular, barras para soldar, resina epoxi, materiales para soldar libres de plomo y haluros, así como aleaciones especializadas de soldadura de indio y oro. Galardonada con numerosos reconocimientos importantes de la industria SMT, AIM está seriamente comprometida con la investigación innovadora, la mejora continua de productos y procesos, a la vez que provee una experiencia de soporte técnico, servicios, y programas de capacitación de primera calidad a sus clientes. Para más información sobre AIM, visita www.aimsolder.com.
