AIM participará en el Simposio de Interconexión de Ultra Alta Densidad de la SMTA
Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona. As a proud member of SMTA, AIM […]
AIM participará en el Simposio de Interconexión de Ultra Alta Densidad de la SMTA Leer Más "