W20
WATER SOLUBLE SOLDER PASTE
Eigenschaften
- Zero halide & halogen per current Rev J-STD-004
- 8+ hour stencil life
- Low voiding on QFN and BGA’s
- Easy to clean residues using DI water
- Extended cleaning window of 2+ weeks
- Low foaming formulation
- Wide reflow process window
- Erhältlich in SAC305
- RoHS Compliant*
W20 Water Soluble Solder Paste
AIM’s W20 Water Soluble Solder Paste has been developed to meet the industry’s demand for a consistently reliable zero-halogen water soluble solder paste. W20 offers enhanced wetting performance in an innovative halogen-free flux chemistry. W20 exhibits excellent print performance with an 8+ hour stencil life while reducing voids on challenging SMT components. This all-purpose water soluble solder paste leaves post-reflow residues that are easily removed with plain or DI water, even under low stand-off devices. W20 is formulated for use with SAC305 T4 powder and is a RoHS compliant solder paste. W20 solder paste can be combined with WS716 liquid flux and WS482 solder wire for a zero-halogen water soluble solution.
*bleifreie Legierungen
- For use in SMT applications where PCB washing is required. W20 residues are easily cleaned using DI water, even under low standoff components
- Provides stable print performance for the most demanding electronic assemblies
- Reduces overall voiding without nitrogen
- Post reflow residues can be cleaned easily after waiting 2 weeks after initial reflow
| Legierungen | Schmelztemperaturen (℃) | Peak Reflow Temperature Range (℃) | Eigenschaften der Legierung |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - Ausgezeichnete Benetzungseigenschaften - Kompatibel mit allen Flussmitteltypen |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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