V9 Low Voiding
NO CLEAN SOLDER PASTE
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-LF-Paste-500g-Jar-300x300.gif)
Eigenschaften
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- Available in SAC305 T4
- REACH- und RoHS-konform*
V9 Low Voiding No Clean Solder Paste
Beschreibung des Produkts
Anwendung Verwendung
Produktdaten-Infos
Technische Dokumente
Product Videos
Beschreibung des Produkts
V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
*bleifreie Legierungen
Anwendung Verwendung
- Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
- Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
- Electrochemical reliability fit for aerospace and military assemblies
- Wide process window: void reduction across a variety of reflow profiles
Produktdaten-Infos
Legierungen | Schmelztemperaturen (℃) | Peak Reflow Temperature Range (℃) | Eigenschaften der Legierung |
---|---|---|---|
SAC305 | 217°C -220°C | 230°C-260°C | - Ausgezeichnete Benetzungseigenschaften - Kompatibel mit allen Flussmitteltypen |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Technische Dokumente
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Product Videos