Underfill FF35 is a low surface tension, single component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast, and complete spread.

Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding and strong adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.

This product is suitable for bare chip protection in a broad variety of small die applications and is compatible with AIM’s full line of no clean flux chemistries.

• Improves mechanical reliability of assembly for use in harsh environments
• Increases drop-shock and vibration performance on SMT components
• Underfill FF35 may be reworked starting at 120°C (250°F)
• Stable viscosity throughout shelf life

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• Underfill FF35 TDS - Englisch
• SDS nachschlagen (Sicherheitsdatenblätter)