Sn42/Bi57/Ag1
LOW TEMPERATURE LEAD-FREE SOLDER ALLOY
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Eigenschaften
- Manufactured with AIM Electropure™ Technology
- Good Fatigue Characteristics
- Improved Wetting
- Low Temp Alloy: Melting Point:138°C
- RoHS Compliant
- Complies with IPC J-STD-006
Sn42/Bi57/Ag1 Low Temperature Alloy
Beschreibung des Produkts
Anwendung Verwendung
Produktdaten-Infos
Technische Dokumente
Beschreibung des Produkts
Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue characteristics versus Sn42/Bi58. It is composed of 42% tin, 57% bismuth and 1% silver.
Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys, reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).
Sn42/Bi57/Ag1 is available with specially formulated fluxes to ensure electrochemical reliability even with reduced soldering temperatures.
Anwendung Verwendung
- Lead-free low melt alloy
- Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
- Reduces NOW/HiP defects on temperature sensitive components
- Good wetting performance required for quick, post-assembly attachments
Produktdaten-Infos
| Composition | Schmelztemperaturen (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Bi/Ag | 138°C | 235°C | $$ |
Technische Dokumente
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- Sn42/Bi57/Ag1 TDS - Englisch
- Sn42/Bi57/Ag1 SDS – Americas English
- Sn42/Bi57/Ag1 SDS – Europe English
- Sn42/Bi57/Ag1 SDS – Asia English