REL61™
LEAD-FREE SOLDER ALLOY
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Eigenschaften
- Cost Saving SAC Alloy
- Enhanced Reliability Versus SAC and All Low/No-Silver Alloys
- Improved Thermal Cycling Performance
- Improved Wetting Versus All Low/No-Silver Alloys
- Aids in AOI First Pass Yields
- Proven Tin Whisker Mitigation
- Lower Process Temperature
- Complies with IPC J-STD-006
REL61 Lead-Free Solder Alloy
Beschreibung des Produkts
Anwendung Verwendung
Produktdaten-Infos
Technische Dokumente
Product Videos
Beschreibung des Produkts
REL61™ is a low-cost alternative to SAC alloys with reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solders.
REL61 has proven to reduce the formation of tin whiskers and outperform SAC alloys in thermal shock, vibration and drop shock reliability testing. REL61 exhibits superior spread, flow and wetting in production testing versus silver-free alloys.
REL61 is available in bar solder, solder wire, and solder paste.
Anwendung Verwendung
- Ideal for automotive, telecom and consumer assemblies
- Smooth uniform appearance in SMT soldering
- Lower reflow/solder pot temperature
- Reduces solder dross in selective and wave soldering applications
- For use in lead-free process only
Produktdaten-Infos
| Composition | Schmelztemperaturen (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Cu/Ag/Bi | 208°C -215°C | 230°C | $$ |
Technische Dokumente
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Product Videos