NC259FPA Ultrafine
NO CLEAN SOLDER PASTE
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-LF-Paste-500g-Jar-300x300.gif)
Eigenschaften
- Precise print definition with Type 6 and finer solder powder
- Excellent Wetting
- High shear strength
- Clear flux residue
- Nitrogen reflow recommended
- Zero halogen/halogen-free
- 8-hour stencil life
- REACH and RoHS Compliant
NC259FPA Ultrafine No Clean Solder Paste
Beschreibung des Produkts
Anwendung Verwendung
Produktdaten-Infos
Technische Dokumente
Beschreibung des Produkts
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AIM’s NC259FPA Ultrafine No Clean Solder Paste is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
Anwendung Verwendung
- MiniLED and MicroLED assembly
- Small and/or complex die attach in semiconductor assembly
- Micro BGA assembly
- Any applications reliant on print apertures ≤ 70 µm
- Dispensing applications such as jet printing
- High density interconnect (HDI) boards
Produktdaten-Infos
Legierungen | Schmelztemperaturen (℃) | Peak Reflow Temperature Range (℃) | Eigenschaften der Legierung |
---|---|---|---|
SN100C | 227°C | 245°C-260°C | • High purity • Eutectic alloy • Low melting temperature |
SAC305 | 217°C -220°C | 230°C-260°C | - Ausgezeichnete Benetzungseigenschaften - Kompatibel mit allen Flussmitteltypen |
*T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Technische Dokumente
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