H10 Halogen-Free
NO CLEAN SOLDER PASTE
Eigenschaften
- Halide/Halogen-Free
- Excellent Wetting
- Low BTC and BGA Voiding
- High Reliability
- Print Capability to 0.50 Area Ratio with T4
- Available in Multiple Lead-Free Alloys
- REACH- und RoHS-konform*
H10 Halogen-Free No Clean Solder Paste
H10 Halogen-Free No Clean Solder Paste is engineered to provide robust, stable performance for automotive, LED lighting and aerospace assemblies. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. H10 is zero halogen per EN14562 and halide-free per IPC J-Std-004 current rev. H10 is compatible with AIM’s full line of no clean flux chemistries.
*bleifreie Legierungen
- Exceptional transfer efficiency required for ultraminiature component assemblies
- Wide process window – drop-in for most AIM no clean solder pastes
- Extended stencil life
- Environmentally friendly: zero halogen
| Legierungen | Schmelztemperaturen (℃) | Peak Reflow Temperature Range (℃) | Eigenschaften der Legierung |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C |
|
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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