14. Januar 2025

AIM nimmt am SMTA Ultra High Density Interconnect Symposium teil

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona. As a proud member of SMTA, AIM […]

AIM nimmt am SMTA Ultra High Density Interconnect Symposium teil Mehr lesen "

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Austin Expo & Tech Forum

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas. Among other great products, AIM will be

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Austin Expo & Tech Forum Mehr lesen "