AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins Circuits Assembly NPI Award
Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its ground breaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the 2024 Circuits Assembly NPI Award for solder materials. This accolade is a testament to AIM Solder’s commitment to …