NC254 Lead-Free Pin Probe Testable No-Clean Solder Paste

Cranston, Rhode Island, USA - AIM is pleased to announce the development of NC254 lead-free pin probe testable no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications.

NC254 is an all-purpose lead-free, pin probe testable no-clean solder paste formulated to perform well in virtually any SMT application. NC254 offers broad process windows for printing, reflow, and pin probe testing.

The superior wetting ability of NC254 results in bright, smooth and shiny solder joints. The thermal stability and excellent wetting of NC254 make it compatible with lead-free alloys and allows wetting to even difficult-to-solder parts. In addition, NC254 has proven to greatly reduce or eliminate solder defects such as voiding under micro-BGAs and solder beading by discrete components, thus reducing costly rework.

NC254 can be printed at high speeds without slumping, provides consistent stencil release and repeatable print volumes for fine-pitch applications, and performs well with open squeegees and enclosed pump printing processes. NC254 offers lengthy stencil life and tack times, even in facilities where environmental control is not at its optimum. NC254 also has shown to be fully compatible with 0201 assembly requirements.

The crystal clear post-process residues of NC254 are probeable from directly after reflow to two months later, even after multiple reflow profiles. NC254 also may be pin probe tested with a variety of probe styles, materials, and pressures and will not gum up probe heads or shatter and flake off during testing.

NC254 has a 12 month refrigerated / 6 month room temperature shelf life and is available in a wide-variety of powder mesh sizes, alloys, and all conventional packaging. NC254 passes all applicable Bellcore and IPC reliability testing.

Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms and specialty alloys such as indium and gold for the electronics assembly, PC fabrication, component manufacturing and other industries. AIM may be contacted at, or visit AIM on the web at

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