WS488
WATER SOLUBLE SOLDER PASTE
![](https://www.aimsolder.com/wp-content/uploads/Water-Soluble-Sn-Pb-Paste-500g-Jar-300x300.gif)
特点
- Halide/Halogen-Free
- Excellent Wetting
- Low BTC and BGA Voiding
- 高 可 靠 性
- Print Capability to 0.50 Area Ratio with T4
- Available in Multiple Lead-Free Alloys
- 符合 REACH 和 RoHS 标准*。
WS488 Water Soluble Solder Paste
AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes.
After reflow, WS488 post-reflow residues are easily cleaned with DI water, especially under low-standoff devices. This simplifies the cleaning process and helps maintain a high level of reliability in the final assembly.
WS488 is available with T4 powder, but it is also compatible with finer powders, making it suitable for both print and dispense applications. Additionally, WS488 solder paste is readily available in SAC305 and Sn63/Pb37 alloys, with the possibility of other alloys upon request.
- For use with electronic assemblies that require post-reflow residue removal
- Residues removed easily using only DI water
- Provides excellent wetting on hard to solder surfaces
- Available for printing and dispensing applications
- Available in lead-free and leaded alloys
合金 | 熔化温度 (℃) | 峰值回流焊温度范围 (℃) | 合金属性 |
---|---|---|---|
SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 • Compatible with most flux types - 无铅合金 |
Sn63/Pb37 | 183°C | 205°C-235°C | - 用于电子焊接的传统合金 - 通过军事规格认证 - 含铅合金 |
*标准尺寸为 T4 粉末网眼。 如有要求,还可提供其他粉末尺寸和合金。
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