V9 Low Voiding
无清洁焊膏
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特点
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- Available in SAC305 T4
- 符合 REACH 和 RoHS 标准*。
V9 Low Voiding No Clean Solder Paste
产品说明
应用用途
产品数据信息
技术文件
Product Videos
产品说明
V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
*无铅合金
应用用途
- Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
- Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
- Electrochemical reliability fit for aerospace and military assemblies
- Wide process window: void reduction across a variety of reflow profiles
产品数据信息
| 合金 | 熔化温度 (℃) | 峰值回流焊温度范围 (℃) | 合金属性 |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 - 与所有助焊剂类型兼容 |
*标准尺寸为 T4 粉末网眼。 如有要求，还可提供其他粉末尺寸和合金。
技术文件
如果您需要的文件没有在下面列出，请联系您当地的 AIM 客户服务代表或 联系我们 申请文件。
Product Videos