M8
无清洁焊膏
特点
- Excellent print transfer efficiencies on 01005s and >0.50 area ratios
- Formulated for use with T4 and finer powders
- Low voiding: <5% on BGAs and <10% on BTC components
- Eliminate s HiP (head-in-pillow) defects
- Minimal transparent residue – LED compliant
- Pin-testable
- Powerful wetting on lead-free surfaces
- Passes Bono and automotive SIR testing
- 8 小时以上的模板寿命
- 有含铅合金和无铅合金可供选择
- 符合 REACH 和 RoHS 标准*。
M8免洗焊锡膏
AIM engineered M8免洗焊锡膏 for the most demanding applications, including 车载, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.
M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.
To guarantee the highest quality, AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.
*无铅合金
M8: Powerful, Reliable, Adaptable
- Provides stable print performance for the most demanding, high density electronic assemblies
- Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
- Accommodates a wide range of profiling processes and techniques
- Reduces DPMO (Defects Per Million Opportunities)
- Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
- Available for printing and dispensing solder paste applications
| 合金 | 熔化温度 (℃) | 峰值回流焊温度范围 (℃) | 合金属性 |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 |
| REL61 | 208°C -215°C | 230°C-250°C | - 与低银/无银合金相比，可靠性更高 - SAC 合金的低成本替代品 - 与低银/无银合金相比，润湿性得到改善 |
| REL22 | 210°C -219°C | 230°C-250°C | • Enhanced/ High reliability for use in extremely harsh environments - 提高热循环性能 - 与低银/无银合金相比，润湿性得到改善 |
| SN100C | 227°C | 240°C-260°C | - SAC 合金的低成本替代品 • Silver-Free - 焊点光亮 |
| Sn63/Pb37 | 183°C | 205°C-235°C | - 用于电子焊接的传统合金 - 通过军事规格认证 • Product contains Pb (leaded alloy) |
*标准尺寸为 T4 粉末网眼。 如有要求，还可提供其他粉末尺寸和合金。
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