Sn42/Bi57/Ag1
LOW TEMPERATURE LEAD-FREE SOLDER ALLOY
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特点
- 采用 AIM Electropure™ 技术制造
- Good Fatigue Characteristics
- Improved Wetting
- Low Temp Alloy: Melting Point:138°C
- 符合 RoHS 规范
- 符合 IPC J-STD-006 标准
Sn42/Bi57/Ag1 Low Temperature Alloy
产品说明
应用用途
产品数据信息
技术文件
产品说明
Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue characteristics versus Sn42/Bi58. It is composed of 42% tin, 57% bismuth and 1% silver.
Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys, reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).
Sn42/Bi57/Ag1 is available with specially formulated fluxes to ensure electrochemical reliability even with reduced soldering temperatures.
应用用途
- Lead-free low melt alloy
- Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
- Reduces NOW/HiP defects on temperature sensitive components
- Good wetting performance required for quick, post-assembly attachments
产品数据信息
| 组成 | 熔化温度 (℃) | Peak Reflow Temperature (℃) | 成本水平 |
|---|---|---|---|
| Sn/Bi/Ag | 138°C | 235°C | $$ |
技术文件
如果您需要的文件没有在下面列出，请联系您当地的 AIM 客户服务代表或 联系我们 申请文件。
- Sn42/Bi57/Ag1 TDS - 英语
- Sn42/Bi57/Ag1 SDS - 美洲英语
- Sn42/Bi57/Ag1 SDS - 欧洲 英语
- Sn42/Bi57/Ag1 SDS - 亚洲英语