REL61™
LEAD-FREE SOLDER ALLOY
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特点
- Cost Saving SAC Alloy
- Enhanced Reliability Versus SAC and All Low/No-Silver Alloys
- Improved Thermal Cycling Performance
- Improved Wetting Versus All Low/No-Silver Alloys
- Aids in AOI First Pass Yields
- Proven Tin Whisker Mitigation
- Lower Process Temperature
- 符合 IPC J-STD-006 标准
REL61 Lead-Free Solder Alloy
产品说明
应用用途
产品数据信息
技术文件
Product Videos
产品说明
REL61™ is a low-cost alternative to SAC alloys with reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solders.
REL61 has proven to reduce the formation of tin whiskers and outperform SAC alloys in thermal shock, vibration and drop shock reliability testing. REL61 exhibits superior spread, flow and wetting in production testing versus silver-free alloys.
REL61 is available in bar solder, solder wire, and solder paste.
应用用途
- Ideal for automotive, telecom and consumer assemblies
- Smooth uniform appearance in SMT soldering
- Lower reflow/solder pot temperature
- Reduces solder dross in selective and wave soldering applications
- For use in lead-free process only
产品数据信息
组成 | 熔化温度 (℃) | Peak Reflow Temperature (℃) | 成本水平 |
---|---|---|---|
Sn/Cu/Ag/Bi | 208°C -215°C | 230°C | $$ |
技术文件
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Product Videos