一步式底部填充 688
SINGLE PART EPOXY
特点
- Excellent Capillary Action
- Flux and Underfill Adhesive in One Step
- 不作废
- Odorless During Printing and Curing
- Non-Hygroscopic
- 稳定流变
- 符合 RoHS 规范
一步式底部填充 688
一步式底部填充 688 is a low surface tension, single component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves assembly reliability through high Tg, low CTE, and good fill with no voiding. Faster throughput and higher yields can be achieved using One-Step Underfill 688 because of its excellent capillary action, fast reflow characteristics, and rapid cure speeds.
One-Step Underfill 688 can be dispensed after solder paste printing, before component placement. The entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process, eliminating the need for a second assembly process and separate cure cycle.
One-Step Underfill 688 wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces and does not require flux. It is compatible with AIM’s full line of no clean flux chemistries.
- 提高组件在恶劣环境中使用的机械可靠性
- 提高 SMT 元件的跌落冲击和振动性能
- 在整个保质期内粘度稳定
- Cures in lead-free profile
- May be reworked starting at 120° C (250°F)
| Flux Classification | Tg | CTE µm/(m* ° C ) | 粘度 |
|---|---|---|---|
| REL1 | 64.1° C Typical | Before Tg – 62.7 ppm Typical After Tg – 174.6 ppm Typical | 150-350 cps |
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- One-Step Underfill 688 TDS - 英语
- 查找 SDS (安全数据表）