NC259FPA Ultrafine
NO CLEAN SOLDER PASTE
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特点
- Precise print definition with Type 6 and finer solder powder
- Excellent Wetting
- High shear strength
- Clear flux residue
- Nitrogen reflow recommended
- Zero halogen/halogen-free
- 8-hour stencil life
- REACH and RoHS Compliant
超细免洗焊膏 NC259FPA
产品说明
应用用途
产品数据信息
技术文件
产品说明
Solder pastes with ultra fine alloy powders, such as T6 or finer, are essential for a range of emerging and advanced applications where precision, reliability, and miniaturization are paramount.
AIM’s 超细免洗焊膏 NC259FPA is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
AIM’s 超细免洗焊膏 NC259FPA is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
应用用途
- MiniLED and MicroLED assembly
- Small and/or complex die attach in semiconductor assembly
- Micro BGA assembly
- Any applications reliant on print apertures ≤ 70 µm
- Dispensing applications such as jet printing
- High density interconnect (HDI) boards
产品数据信息
合金 | 熔化温度 (℃) | Peak Reflow Temperature Range (℃) | 合金属性 |
---|---|---|---|
SN100C | 227°C | 245°C-260°C | • High purity • Eutectic alloy • Low melting temperature |
SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 - 与所有助焊剂类型兼容 |
*T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
技术文件
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