NC259FPA Ultrafine
无清洁焊膏
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-LF-Paste-500g-Jar-300x300.gif)
特点
- Precise print definition with Type 6 and finer solder powder
- 出色的润湿性
- High shear strength
- Clear flux residue
- Nitrogen reflow recommended
- Zero halogen/halogen-free
- 8-hour stencil life
- REACH and RoHS Compliant
超细免洗焊膏 NC259FPA
产品说明
应用用途
产品数据信息
技术文件
产品说明
![](https://aimsolderprod.wpengine.com/wp-content/uploads/2024-NPI_winner_seal-300x244.png)
AIM 的 超细免洗焊膏 NC259FPA is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
应用用途
- MiniLED and MicroLED assembly
- Small and/or complex die attach in semiconductor assembly
- Micro BGA assembly
- Any applications reliant on print apertures ≤ 70 µm
- Dispensing applications such as jet printing
- High density interconnect (HDI) boards
产品数据信息
合金 | 熔化温度 (℃) | 峰值回流焊温度范围 (℃) | 合金属性 |
---|---|---|---|
SN100C | 227°C | 245°C-260°C | - 高纯度 - 共晶合金 - 熔化温度低 |
SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 - 与所有助焊剂类型兼容 |
*T6 powder mesh size is standard. 如有要求,还可提供其他粉末尺寸和合金。
技术文件
如果您需要的文件没有在下面列出,请联系您当地的 AIM 客户服务代表或 联系我们 申请文件。