NC257MD Jet Printing
无清洁焊膏
特点
- Engineered for use with Mycronic jet printers
- For use with Mycronic AG type ejector
- Clear, pin-testable residues
- 8-12 hour tack time
- Excellent wetting characteristics, even on leadless devices
- Vapor phase compatible
- Reduces voiding under micro-BGAs
- Prolongs ejector/cassette life
NC257MD No Clean Solder Paste
AIM developed NC257MD No Clean Solder Paste specifically for use with Mycronic MY500, MY600, and MY700 jet printers. Extensive testing in collaboration with Mycronic validates NC257MD’s unique rheological properties, ensuring powerful wetting performance on continuous and consistent deposits. NC257MD extends ejector life, leading to a reduction in solder paste scrap and consumption.
This solder paste offers reduced voiding while producing minimal, clear residues that can be easily probed for testing purposes. Moreover, NC257MD boasts a long tack life of up to 12 hours, maximizing performance, increasing line flexibility, and improving soldering results.
- Provides stable dispensing and jetting performance for the most demanding assembly applications
- Reduces voiding on a variety of LED, QFN, and LGA components
- Residues are clear, pin-testable with high SIR properties
- Formulated for jet dispensing with Mycronic MY500, MY600, and MY700 jet printers
| 合金 | 熔化温度 (℃) | 峰值回流焊温度范围 (℃) | 合金属性 |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - 出色的润湿特性 |
| Sn63/Pb37 | 183°C | 205°C-235°C | - 用于电子焊接的传统合金 |
*标准尺寸为 T4 粉末网眼。 如有要求，还可提供其他粉末尺寸和合金。
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