NC217
NO CLEAN GEL FLUX
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-Paste-30cc-Syringe-133x300.gif)
特点
- Formulated for Rework and Repair
- Ideal for BGAs: Wide Process Window
- Electrically Safe Unheated
- ROL0
- Controlled Application
- Easy to Clean Residue
- Passes SIR in Raw State
NC217 No Clean Gel Flux
产品说明
应用用途
产品数据信息
技术文件
产品说明
NC217 No Clean Gel Flux is specifically formulated for rework of all types of surface mount components. Its gel-like consistency is engineered for easy touch-up and precise flux application.
Dried, NC217 flux residues pass IPC J-STD-004* SIR without additional heat and are tack-free in 2-4 hours. The powerful activator system of NC217 promotes wetting and shiny joints even on difficult to solder surfaces.
NC217 is compatible with AIM’s entire line of no clean solder paste, cored solder wire, and flux formulations, meeting IPC-610 flux requirements.
应用用途
- Ideal for BGA rework/reballing and QFN/LGA repair
- Residues can be left on the board after soldering
• When cleaning is required, residues can be removed using common flux removers - Wide process window offers increased manufacturing flexibility
- Residues pass SIR without adding heat
• Ideal for automotive, medical, and aerospace applications - Tin-Lead and lead-free compatible
- Improved heat transfer results in reduced cycle time
- Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units
产品数据信息
助焊剂类别 | Applications | Application Method | Alloy Compatibility |
---|---|---|---|
ROL0 | BGA Sphere Attach Rework Component Removal | Dispense Dip | Pb and PB-Free |
技术文件
如果您需要的文件没有在下面列出,请联系您当地的 AIM 客户服务代表或 联系我们 申请文件。