H10无卤免洗焊锡膏 is engineered to provide robust, stable performance for automotive, LED lighting and aerospace assemblies. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.  H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. H10 is zero halogen per EN14562 and halide-free per IPC J-Std-004 current rev. H10 is compatible with AIM’s full line of no clean flux chemistries.

*无铅合金

• Exceptional transfer efficiency required for ultraminiature component assemblies
• Wide process window – drop-in for most AIM no clean solder pastes
• Extended stencil life
• Environmentally friendly: zero halogen

*标准尺寸为 T4 粉末网眼。 如有要求，还可提供其他粉末尺寸和合金。

如果您需要的文件没有在下面列出，请联系您当地的 AIM 客户服务代表或 联系我们 申请文件。

• H10 Product Line Card
• H10 TDS - 英语
• 查找 SDS (安全数据表）