美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona. As a proud member of SMTA, AIM Solder is committed to advancing the industry’s knowledge and capabilities through collaboration and innovation.
The UHDI Symposium provides a unique platform for professionals in the semiconductor and electronics industries to explore the latest advancements in PCB design, fabrication, assembly, and reliability. This year’s event will address key topics, including miniaturization in assembly, breakthroughs in PCB fabrication, design for manufacturability (DFM), and emerging technologies such as LCP with 10-micron embedded traces. Attendees will gain insights into how these innovations are driving the industry toward smaller, more powerful, and reliable technologies.
AIM Solder’s Gayle Towell will be a featured panelist during Session 4 at 4:00 PM, contributing to the discussion, “Bridging the Gap: Accelerating Ultra HDI Adoption Through Collaboration.” The panel will explore strategies for fostering partnerships across the supply chain to streamline UHDI adoption and enhance technological outcomes.
“As the electronics industry continues its push toward miniaturization and UHDI, AIM remains at the forefront, delivering innovative solutions and expert technical support to address these challenges,” said Gayle Towell. “We are excited to contribute to this critical dialogue at the UHDI Symposium.”
总部位于加拿大蒙特利尔，AIMSolder是全球领先的电子行业组装材料制造商，其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品，如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品，以及特殊合金，如铟和金，用于各种不同的行业。作为众多著名SMT行业奖项的获得者，AIM致力于产品和工艺改进的创新研发，并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息，请访问 www.aimsolder.com。