美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Queretaro Expo & Tech Forum taking place on June 6 at Queretaro Centro de Congresos y Teatro Metropolitano in Queretaro, Mexico. Among other great products, AIM will be highlighting its recently released 超细免洗焊膏 NC259FPA.
NC259FPA是一款无卤焊锡膏，专为满足miniLED、microLED、芯片贴装、microBGA和HDI板应用的苛刻要求而开发。该产品适合T6和更细的合金粉末，能够通过直径小于150µm的钢网开孔，得到精准的印刷效果，从而使其在微型化和精细度方面树立了行业新的标准。
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Queretaro Expo & Tech Forum on June 6th, or visit www.aimsolder.com.
总部位于加拿大蒙特利尔，AIMSolder是全球领先的电子行业组装材料制造商，其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品，如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品，以及特殊合金，如铟和金，用于各种不同的行业。作为众多著名SMT行业奖项的获得者，AIM致力于产品和工艺改进的创新研发，并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息，请访问 www.aimsolder.com.
