美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on March 14 at the Cintermex Convention Center Hall A2 in Monterrey, Nuevo Leon, Mexico. Among other great products, AIM will be highlighting its recently released 超细免洗焊膏 NC259FPA.
NC259FPA是一款无卤焊锡膏，专为满足miniLED、microLED、芯片贴装、microBGA和HDI板应用的苛刻要求而开发。该产品适合T6和更细的合金粉末，能够通过直径小于150µm的钢网开孔，得到精准的印刷效果，从而使其在微型化和精细度方面树立了行业新的标准。
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Monterrey Expo & Tech Forum on March 14th, or visit www.aimsolder.com.
总部位于加拿大蒙特利尔，AIMSolder是全球领先的电子行业组装材料制造商，其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品，如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品，以及特殊合金，如铟和金，用于各种不同的行业。作为众多著名SMT行业奖项的获得者，AIM致力于产品和工艺改进的创新研发，并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息，请访问 www.aimsolder.com.
