美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Arizona Expo & Tech Forum taking place on November 14, 2023, at the Double Tree by Hilton in Mesa, Arizona. AIM will highlight their newest halogen-free no clean solder paste, H10.
H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM’s brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.
H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
To discover all of AIM’s products and services, visit the company at the SMTA Arizona Expo & Tech Forum taking place on November 14, or visit www.aimsolder.com.
总部位于加拿大蒙特利尔，AIMSolder是全球领先的电子行业组装材料制造商，其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品，如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品，以及特殊合金，如铟和金，用于各种不同的行业。作为众多著名SMT行业奖项的获得者，AIM致力于产品和工艺改进的创新研发，并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息，请访问 www.aimsolder.com.
