美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Advanced Electronics Assembly Conference taking place on April 24, 2024 at BOK Hall in Budapest, Hungary. AIM Technical Application Engineer, Norbert Labai, will present on the topic: Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.
Norbert Labai has been in the electronics industry for over 20 years. Mr. Labai supports AIM customers throughout Eastern Europe in solving the most challenging technical issues and adopting the latest application technologies. The abstract for his presentation is as follows:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
Mr. Labai will deliver his presentation at the Advanced Electronics Assembly Conference at 10:15 am on April 24. To learn more about AIM’s products and services, visit www.aimsolder.com.
总部位于加拿大蒙特利尔，AIMSolder是全球领先的电子行业组装材料制造商，其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品，如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品，以及特殊合金，如铟和金，用于各种不同的行业。作为众多著名SMT行业奖项的获得者，AIM致力于产品和工艺改进的创新研发，并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息，请访问 www.aimsolder.com.
