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AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins Circuits Assembly NPI Award

美国罗德岛州克兰斯顿 – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its ground breaking product, 超细免洗焊膏 NC259FPA, has been honored with the 2024 Circuits Assembly NPI Award for solder materials. This accolade is a testament to AIM Solder’s commitment to innovation and excellence in the electronics manufacturing industry.

The Circuits Assembly NPI Awards recognize the leading new products for electronics assembly during the past year. Winning this award underscores AIM Solder’s dedication to developing products that advance the electronics manufacturing sector, meet the evolving needs of our customers, and set new standards for quality and reliability.

The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter, setting a new industry standard in miniaturization and precision.

Key features of the NC259FPA Ultrafine No Clean Solder Paste include:

  • Excellent Wetting: Ensures strong, reliable joints for long-term performance.
  • High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
  • 高 可 靠 性: Meets the rigorous standards required in high-performance electronics manufacturing.
  • High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.

“We are incredibly proud to receive the 2024 Circuits Assembly NPI Award,” said Timothy O’Neil, Director of Product Management at AIM Solder. “This award is a reflection of our team’s hard work, dedication, and relentless pursuit of excellence. We remain committed to providing our customers with superior products and services, and this recognition further motivates us to continue innovating and exceeding industry standards.”

For more information about AIM Solder’s NC259FPA Ultrafine No Clean Solder Paste and other products, please visit www.aimsolder.com.

关于 AIM

总部位于加拿大蒙特利尔,AIMSolder是全球领先的电子行业组装材料制造商,其生产、分销和支持网络遍布全球。AIM生产先进的焊料产品,如焊锡膏、液体助焊剂、带芯锡线、焊锡条、环氧树脂、无铅和无卤素焊料产品,以及特殊合金,如铟和金,用于各种不同的行业。作为众多著名SMT行业奖项的获得者,AIM致力于产品和工艺改进的创新研发,并为客户提供卓越的技术支持、服务和培训。有关AIM全系列先进焊料产品和全球技术服务的更多信息,请访问 www.aimsolder.com.

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