AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED Materials Award at Hangjia
Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the Most Influential MiniLED Materials Award at the recent Hangjia Aurora Awards Ceremony. This prestigious accolade was presented […]