Blog

When I started at AIM Solder in 1997, the electronics industry looked very different. Phones were bigger, computers were bulkier, and most manufacturing was done in a handful of key regions. Fast forward to today, and everything has changed. Electronics keep getting smaller and more powerful, manufacturing has expanded across the globe, and supply chains […]

If you’ve ever looked at a solder flux label and felt like you were trying to decipher a secret code, you’re not alone. The string of letters and numbers—like ROL0, ORM1, or REL1—can seem cryptic at first glance.

Dross formation is an inevitable byproduct of the wave soldering process, but excessive dross can lead to unnecessary material waste, increased costs, and process inefficiencies. This blog post gives some insight into dross, including common questions and steps you can take to reduce dross formation in your solder pot. What is Dross? Dross is the

For nearly 20 years, I’ve had the chance to work with our customers every day, listening to their challenges, helping to find solutions, and making sure they have what they need to succeed. Now, as I step into my new role as Vice President, Customer Experience, my goal is to make sure the support we offer is

Preparing for the Next Evolution in Miniaturization AIM Solder is proud to declare 2025 as “The Year of Type 5,” recognizing the growing importance of this powder size and the shift it represents in the industry. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating,

If you’ve come across the words Type 4, Type 5, or T4, T5, T6 regarding solder paste and wondered what that meant, you’ve come to the right place. First, note that while solder paste might look like a uniform gray blob, it’s actually a carefully engineered mixture of powdered metal and a gooey medium called

Solder paste is made from solder powder – tiny spheres of alloyed metal, combined with a flux medium – rosins, resins, and other chemicals designed to promote cleaning and prevent oxidation.  

This article explores REL61’s place in the evolution of lead-free solder, the unique advantages of its bismuth-enhanced formulation, and its performance compared to widely used alternatives like SAC305.

Tin, with its rich history spanning ancient civilizations to modern electronics, remains an integral metal in soldering. In this post, we explore tin’s journey—from historical significance to global market, sourcing, and processing. We’ll also delve into the increasing demand for tin, its recycling initiatives, and the push for a sustainable future.

Although the rework bench plays a critical role in electronics manufacturing, engineers often overlook its cleanliness due to its lack of flashy machinery and perceived simplicity.

Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes.