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Stay ahead of the ever-evolving world of solder technology with technical advice, industry innovations, and stories from the heart of AIM.

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Recent Blog Posts

  • All
  • Solder Alloys
  • Solder Reclaim
  • Ultrafine Solder Paste
All
  • All
  • Solder Alloys
  • Solder Reclaim
  • Ultrafine Solder Paste
REL61 solder in bar, wire, jar, and cartridge forms.
Blog

AIM’s REL61 Solder Alloy

This article explores REL61’s place in the evolution of lead-free solder, the unique advantages of its bismuth-enhanced formulation, and its performance compared to widely used alternatives like SAC305.
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Blog

All About Tin: Sourcing, Soldering, and Sustainability

Tin, with its rich history spanning ancient civilizations to modern electronics, remains an integral metal in soldering. In this post, we explore tin's journey—from historical significance to global market, sourcing, ...
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Blog

Preventing Electrochemical Contamination at the Rework Station 

Although the rework bench plays a critical role in electronics manufacturing, engineers often overlook its cleanliness due to its lack of flashy machinery and perceived simplicity.
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Solder paste being applied via squeegee
Blog

How to Stay Within the SMT Assembly Process Window

Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes. 
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Blog

Ultrafine Solder Paste Printing in Electronics Manufacturing

As the electronics industry pushes the boundaries of miniaturization, the precision of solder paste printing has taken center stage in the manufacturing process. This evolution demands not only meticulous technique, ...
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