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AIM Blog

Stay ahead of the ever-evolving world of solder technology with technical advice, industry innovations, and stories from the heart of AIM.

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Recent Blog Posts

  • All
  • electrochemical contamination
  • rework
  • Solder Alloys
  • Solder Reclaim
  • Ultrafine Solder Paste
All
  • All
  • electrochemical contamination
  • rework
  • Solder Alloys
  • Solder Reclaim
  • Ultrafine Solder Paste
Blog

Preventing Electrochemical Contamination at the Rework Station 

Although the rework bench plays a critical role in electronics manufacturing, engineers often overlook its cleanliness due to its lack of flashy machinery and perceived simplicity.
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Solder paste being applied via squeegee
Blog

How to Stay Within the SMT Assembly Process Window

Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes. 
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Blog

Ultrafine Solder Paste Printing in Electronics Manufacturing

As the electronics industry pushes the boundaries of miniaturization, the precision of solder paste printing has taken center stage in the manufacturing process. This evolution demands not only meticulous technique, ...
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Blog

Alloy Evolution: The Path from SAC305 to High-Reliability 

As industry needs evolved, so did solder alloys, addressing specific performance requirements and setting new benchmarks. This article embarks on a chronological exploration of this alloy evolution journey, highlighting pivotal ...
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Blog

Maximize Value and Sustainability with AIM’s Solder Reclaim 

In the rapidly evolving electronics industry, managing waste, particularly solder waste, has become a critical environmental and economic challenge. AIM Solder recognizes the significance of this issue, which is why ...
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