AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam
Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste. […]
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