RMA258-15R SOLDER PASTE

Features: 
- Long Pause-to-Print Capabilities
- Enhances Fine Print Definitions
- No Head-in-Pillow
- Excellent Wetting, Even Leadless Devices
- Exceptional Reflow During Long, Hot Profiles
- Reduced Voiding
- Available in Industry Standard Sizes

 

RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and shiny solder joints. RMA258-15R is capable of exceptional reflow during long, hot profiles.  RMA258-15R leaves medium, amber colored post process residues.  Available in tin/lead and lead-free, including no- and low-silver alloys.