Additional Solder Materials
Optimized & Industry-ready Solutions
AIM Additional Materials
AIM offers a variety of epoxies, underfills, chemicals and cleaners that are fully compatible with our many solder pastes, epoxies, fluxes and cored wires. Formulated for application by hand or automated dispensing equipment, these products are available in industry standard packaging.
AIM’s epoxy products can be used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly.
AIM’s underfill products have low surface tension and are designed for use as a capillary flow underfill for flip chip, CSP, BGA and µBGA assemblies.
AIM’s understencil wipe solvents are compatible with all AIM no clean and water-soluble solder pastes, formulated for hand application or by automated understencil wiper.
Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications.